Class 240 Polyimide Flat Copper Magnet Wire

Insulation materials: Polyimide
Thermal Class: 240
Dimensions: Thickness: 0.8mm-5.6mm; Width:2mm-16mm
Standard: MW 20-C

Class 240 Polyimide Flat Copper Magnet Wire

Class 240 Polyimide Flat Copper Magnet Wire is a high-performance magnet wire designed for applications requiring exceptional thermal endurance and durability. With a thermal class rating of 240°C, this wire features a polyimide insulation, providing excellent heat resistance, chemical stability, and mechanical strength.

Advantages:

 The flat copper form enhances space utilization and conductivity, making it ideal for compact, high-efficiency designs.

Insulating Material

The coating is based on aromatic polyimide resins

The insulation layer consists of one or two layers of polyimide film tape, which is coated on one or both sides with a suitable adhesive, such as fluorinated ethylene propylene. After winding, the film tape can be sintered to form a continuous, bonded sheath. 

Class 240 Polyimide Flat Copper Magnet Wire is mainly used in electrical equipment that requires long-term exposure to high temperatures or special environmental conditions.

Transformers

Motors

Other Electromagnetic Coils: For devices like relays, sensors, and various induction devices, etc.

Special Environments: In settings with high temperatures, high humidity, or chemical corrosion—such as industrial automation and chemical processing equipment

Table 1 Dimensions

Insulation materialsPolyimide
Thermal Class240
DimensionsThickness: 0.8mm-5.6mmWidth:2mm-16mm
StandardMW 20-C

Table 2 Properties

Adherence and flexibilityNo cracks visible in the film coating
ElongationMW Specification:18, 20, 36, 38, 64, 84
T ≥ 0.049: 32
T < 0.049:30
Heat shockNo cracks in the film coating after 15% elongation followed by conditioning at 280°C ±3ºC
SpringbackNot greater than 5°
Dielectric breakdown500V – 1500V
Dissipation FactorNot greater than 0.60%

Table 3 Periodic conformance tests

SolubilitySpecimens immersed in xylene and 50/50 xylene/butyl Cellosolve shall not soften sufficiently to expose the bare conductor
Dielectric breakdown rated temperatureAverage not less than 75% of the value required at room temperature
Thermoplastic flowMedian not less than 450°C, when tested on MW 16-C Heavy build

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