Class 180 Polyurethane Round Copper Wire for Solderable Applications

Dimensions:

single:25-56AWG

minimum increase: 0.0013mm-0.023mm

maximum overall: 0.0165mm-0.493mm

heavy: 25-50AWG

minimum increase: 0.0051mm-0.046mm

maximum overall: 0.0356mm-0.516mm

triple: 30-44 AWG

minimum increase: 0.015mm-0.051mm

maximum overall: 0.074mm-0.320mm

Class 180 Polyurethane Round Copper Wire for Solderable Applications

The versatility and reliability of Class 180 polyurethane round copper wire make it well-suited for a wide array of applications across different industries.

Insulating Material: The coating is based on polyurethane resins.

Dimensions:

single:25-56AWG

minimum increase: 0.0013mm-0.023mm

maximum overall: 0.0165mm-0.493mm

heavy: 25-50AWG

minimum increase: 0.0051mm-0.046mm

maximum overall: 0.0356mm-0.516mm

triple: 30-44 AWG

minimum increase: 0.015mm-0.051mm

maximum overall: 0.074mm-0.320mm

Adherence And Flexibility: No cracks visible in the film coating

Elongation: Not less than 10%

Heat Shock: No cracks visible in the film coating after conditioning at 200°C

Springback:  Not greater than 76°

Dielectric Breakdown:

25-37 AWG: not less than 1220V

38-56 AWG: not less than 80V

Continuity:

25-44 AWG: max number of discontinuities in this table

BuildSelf-BondingSingleType 1Heavy Type 2Triple Type 3Quad
Copper
14-24 AWG1000150020002500
24.5-30750100015002000
30.5-3550075010001500
35.5-443505007501000
Maximum Fault Count per 100 ft.15533

45-56 AWG: max number of discontinuities in next table.

Film Insulation BuildSelf-BondingSingleType 1Heavy Type 2
Material/AWG RangeCopper/44-56 AWG2510

Periodic Conformance Tests:

Thermoplastic Flow: Median not less than 225°C

Solubility: Specimens immersed in xylene shall not soften sufficiently to expose the bare Conductor

Dielectric Breakdown At Rated Temperature: Average not less than 75% of the value required at room temperature

Class 180 polyurethane round copper wire is a versatile and reliable wiring solution that offers numerous benefits for solderable applications.

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