Class 200 polyester (amide)(imide) overcoated with polyamideimide film-insulated round copper wire consists of a copper conductor that is round in shape and insulated with a combination of materials.
Insulating Material: The conductor shall be coated with a dual film. The underlying coating is based on polyester (amide)(imide) resins. The superimposed coating is based on polyamideimide resins.
Dimensions:
| Insulation thickness | Diameter |
| single | 14-44 AWG min: 0.005mm-0.041mmmax:0.061mm-1.692mm |
| heavy | 2-44 AWGmin: 0.010mm-0.097mmmax: 0.066mm-6.690mm |
| Triple | 14-44 AWGmin: 0.015mm-0.122mmmax: 0.074mm-1.773mm |
| Quad | 10-30 AWGmin: 0.066mm-0.172mmmax: 0.351mm-2.789mm |
Adherence And Flexibility: No cracks visible in the film coating
Elongation: Not less than 10 %
Heat Shock: No cracks visible in the film coating after conditioning at 220ºC
Springback:
14-30 AWG: not greater than 42º
2-13.5 AWG: not greater than 5º
Dielectric Breakdown:
4-9.5 AWG: not less than 1870V
10-23.5 AWG: not less than 2470V
24-37 AWG: not less than 1220V
38-44 AWG: not less than 275V
Continuity: 14-44
| BuildSelf-Bonding | SingleType 1 | Heavy Type 2 | Triple Type 3 | Quad |
| 14-24 AWG | 1000 | 1500 | 2000 | 2500 |
| 24.5-30 | 750 | 1000 | 1500 | 2000 |
| 30.5-35 | 500 | 750 | 1000 | 1500 |
| 35.5-44 | 350 | 500 | 750 | 1000 |
| Maximum Fault Count per 100 ft. | 15 | 5 | 3 | 3 |
Periodic Conformance Tests:
Thermoplastic Flow: Median not less than 300°C
Solubility: Specimens immersed in xylene and 50/50 xylene/butyl Cellosolve shall not soften sufficiently to expose the bare conductor.
Dielectric Breakdown At Rated Temperature: Average not less than 75% of the value required at room temperature.
This type of wire is often used in applications where high temperature resistance and good electrical properties are required.