Class 180 Polyurethane Overcoated with Polyamide Round Copper Wire for Solderable Applications

Dimensions:

single:14-44AWG

minimum increase: 0.005mm-0.041mm

maximum overall: 0.061mm-1.692mm

heavy: 14-44AWG

minimum increase: 0.010mm-0.081mm

maximum overall: 0.066mm-1.732mm

triple: 25-44 AWG

minimum increase: 0.015mm-0.069mm

maximum overall: 0.074mm-0.538mm

Class 180 Polyurethane Overcoated with Polyamide Round Copper Wire for Solderable Applications

Class 180 Polyurethane Overcoated with Polyamide Round Copper Wire combines copper conductivity, temperature resistance, solderability, and mechanical durability.

Insulating Material: The conductor shall be coated with a dual film. The underlying insulation is based on polyurethane resins. The superimposed coating is based on polyamide resins.

Dimensions:

single:14-44AWG

minimum increase: 0.005mm-0.041mm

maximum overall: 0.061mm-1.692mm

heavy: 14-44AWG

minimum increase: 0.010mm-0.081mm

maximum overall: 0.066mm-1.732mm

triple: 25-44 AWG

minimum increase: 0.015mm-0.069mm

maximum overall: 0.074mm-0.538mm

Adherence And Flexibility: No cracks visible in the film coating

Elongation: Not less than 5%

Heat Shock: No cracks visible in the film coating after conditioning at 200°C

Springback:  Not greater than 76°

Dielectric Breakdown:

14-23.5 AWG: not less than 2470V

24-37 AWG: not less than 1220V

38-44 AWG: not less than 275V

Continuity:

BuildSelf-BondingSingleType 1Heavy Type 2Triple Type 3Quad
Copper
14-24 AWG1000150020002500
24.5-30750100015002000
30.5-3550075010001500
35.5-443505007501000
Maximum Fault Count per 100 ft.15533

Periodic Conformance Tests:

Thermoplastic Flow: Median not less than 225°C

Solubility: Specimens immersed in xylene shall not soften sufficiently to expose the bare Conductor

Dielectric Breakdown At Rated Temperature: Average not less than 75% of the value required at room temperature

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